Nir Sever

There are some 8'' LNOI samples for testing now. 🤝 #8inchLNOI LN is 300nm, SiO2 is 4.4um, Si (low resistivity) LN is 400nm, SiO2 is 4.4um, Si (low resistivity)

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LUMEOVA is unveiling WiRays®, a wireless optical communication technology designed to deliver 10X speed over WiFi! After years of intensive R&D, we are pleased to announce that we are taking the wraps off WiRays®, an innovative wireless optical communication technology that we believe will enable fiber optic speeds without the fiber! LUMEOVA has uniquely funded development of WiRays® with a combination of grants and proceeds of $8M consulting revenue to date. This has enabled us to complete the early design and development stages with non-dilutive funding and build a strong IP portfolio of 20 patents. We are now planning to shift into next gear and aim to launch first generation WiRays® products to market by 2025. To achieve this, we are considering raising our first round of capital via StartEngine using the crowdfunding (Reg CF) process. Reserve now at: https://lnkd.in/ekeqjhVH Disclaimer: NO MONEY OR OTHER CONSIDERATION IS BEING SOLICITED, AND IF SENT IN RESPONSE, WILL NOT BE ACCEPTED. NO OFFER TO BUY THE SECURITIES CAN BE ACCEPTED AND NO PART OF THE PURCHASE PRICE CAN BE RECEIVED UNTIL THE OFFERING STATEMENT IS FILED AND ONLY THROUGH AN INTERMEDIARY’S PLATFORM. AN INDICATION OF INTEREST INVOLVES NO OBLIGATION OR COMMITMENT OF ANY KIND. "RESERVING" SECURITIES IS SIMPLY AN INDICATION OF INTEREST.

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Brand ; Sharp Item ; Proximity sensor Model : GP2AP070S00F Q’ty : 4,000,000ea date code : 2018 looking for eat all buyer China India Taiwan buyer 。#europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation ]#personaldevelopment #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Tec

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𝗔𝗦𝗛𝗟𝗜𝗡𝗚 𝗔𝗡𝗗 𝗘𝗠𝗕𝗘𝗖𝗢𝗦𝗠 𝗧𝗢 𝗔𝗖𝗖𝗘𝗟𝗘𝗥𝗔𝗧𝗘 𝗥𝗜𝗦𝗖-𝗩 𝗩𝗘𝗖𝗧𝗢𝗥 𝗤𝗘𝗠𝗨 𝗘𝗠𝗨𝗟𝗔𝗧𝗜𝗢𝗡. Ashling and our partner Embecosm are working with the RISE (RISC-V Software Ecosystem) project to optimize RISC-V vector instructions emulation for QEMU the open-source emulator. Our goal is to ensure that RISC-V vector instruction powered binaries run at rocket 🚀 🚀 🚀 speed under QEMU by mapping the RISC-V vector instructions to the best hardware equivalents on the host, leveraging up to 256-bit SIMD vectors for maximum performance. The RISC-V Software Ecosystem (RISE) Project focuses on accelerating the development of open-source software for the RISC-V architecture. See: https://riseproject.dev/ #RISCV #QEMU

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H Bridge SiC module

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During this webinar, we'll dive into different techniques for controlling GaN Power Amplifiers in radar systems, aiming to identify the most efficient method.

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1200V 900A Hybrid module. With SiC SBD diode inside，the turn on switching loss is reduced to a very low level.

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Perfect for flex LED strips used in aluminum profiles 👍

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In order to have strong #ReRAM technology you need to have a very strong team of experts in multiple fields. I don't believe any company has such a strong combination of experts as Weebit Nano Ltd has, from the 13 PhDs we have in Physics and Chemistry developing the device, to the strong process team, as well as our very strong analog and digital design teams. This blog by Eran Briman explains the importance of each pillar and how the combination enables such a strong technology

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"𝑰𝒇 𝒚𝒐𝒖𝒓 𝒂𝒄𝒕𝒊𝒐𝒏𝒔 𝒊𝒏𝒔𝒑𝒊𝒓𝒆 𝒐𝒕𝒉𝒆𝒓𝒔 𝒕𝒐 𝒅𝒓𝒆𝒂𝒎 𝒎𝒐𝒓𝒆, 𝒍𝒆𝒂𝒓𝒏 𝒎𝒐𝒓𝒆, 𝒅𝒐 𝒎𝒐𝒓𝒆 𝒂𝒏𝒅 𝒃𝒆𝒄𝒐𝒎𝒆 𝒎𝒐𝒓𝒆, 𝒚𝒐𝒖 𝒂𝒓𝒆 𝒂 𝒍𝒆𝒂𝒅𝒆𝒓." -𝑱𝒐𝒉𝒏 𝑸𝒖𝒊𝒏𝒄𝒚 𝑨𝒅𝒂𝒎𝒔 Here is some latest update about Embedkari community : Good News : *One member joined commercial Satellite making company last month *One candidate joined as Sr FAE *Two have offers in hand *One member has Engagement ceremony this week and other is getting married. Both are sincere about career growth as well. We have few embedded system candidates available for PAN India, US, Canada and Remote *I started new Sunday batch today with 2.5 hours discussion for Cortex M Programming model , Memory model , NVIC , Assembly basics etc. We had good discussion over few Embedded C concepts as well. *Provided some tips for hardware debugging during doubt clarification session. My simple message to student : Try to learn the concept in the class itself. No need to just make a note and keep learning pending for future. Book your slots for live session in advance. Don't wait for any batch to be started. https://lnkd.in/gMsMHTYP #embeddedsystems #embeddedc #microcontroller #microcontrollers #embedded #embeddedsystem #embeddedlinux #freertos #firmware #firmwareengineer #firmwarejobs #devicedriver #softwareengineers #electronics #embeddedjobs #embeddedengineer #embedkari #indiajobs #careers #jobs #opentowork #openings #hiring #work #freshers

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What’s common between Overfitting, noise, GLRT (Generalized likelihood ratio test) and #AI #ML ? Want to know and perhaps also remove some misconceptions about overfitting, read below. #radar #ai #ml #deeplearning #GLRT #LRT #hypothesistesting AlephZero (א‎₀) #techtwins #statistics #probability

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For those companies in Israel: AI represents a potentially huge leap forward for verification. A number of companies, including Breker, are now including AI algorithms in several verification solutions to expand their effectiveness.  However, this is scratching the surface of the real possibilities afforded by this technology. Breker, the test content generation leader, is expanding their use of AI in partnership with several leading semiconductor companies.  We are proposing an environment where we can easily provide scenario descriptions, control coverage, and drive execution platforms using AI generated test content. VerifyGPT is closer than you think. Come see David Kelf, Breker’s CEO, at ChipEx in Tel Aviv on May 7th, 2024 discuss the state of the art so far, what is being used for SystemVIP’s such as RISC-V and Coherency, and how we reach the inevitable reality of AI-based verification. Presentation will be from 12:20 - 12:40pm https://lnkd.in/g65VEGw3 #systemverilog #pss #uvm #systemvip #riscv #verification

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The market for embedded #NVM is expanding quickly, with various technologies competing for different applications. Want to hear more? Read this article I recently posted on embedded.com. #ReRAM #semiconductor

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Intel submits Gaudi 2 results on MLCommons’ newest benchmark by fine-tuning Llama 2 70B using low-rank adapters and training MLPerf GPT-3 model with 1,000+ Gaudi 2s on Intel Tiber Developer Cloud. #IAmIntel https://bit.ly/4ewRR0m

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**Innovative CXL 3.0 Controller FPGA proven IP Core for all Small & Medium Enterprises : Redefining High-Speed Connectivity** **Comprehensive Protocol Support:**   - **CXL.io, CXL.mem, and CXL.cache:** Implements advanced protocols for seamless data transmission. **Versatile Device Compatibility:**   - **Type 1, Type 2, and Type 3 Support:** Compatible with diverse device types, enhancing system flexibility. **Next-Generation Specification Compliance:**   - **CXL 3.0:** Fully compliant with the latest specification for future-proof capabilities. **Optimized Data Transfer Efficiency:**   - **Multiple Flit Modes:** Supports 68B and 256B flit modes, optimizing data throughput. - **Latency-Optimized FLIT Mode:** Minimizes transfer delays, improving system performance. **Flexible Interface Configuration:**   - **Adaptable PIPE 6.x Specification:** Configurable interface widths (32-bit, 64-bit, 128-bit) for seamless integration. **Scalable Lane Operation:**   - **Multi-Lane Support:** Operates at x16, x8, x4, x2, and x1 lane configurations, optimizing bandwidth efficiency. **Specialized Data Handling Interfaces:**   - **Native Qbit Interface:** Specifically designed for CXL.mem and CXL.cache applications, ensuring reliable data transactions. **Enhanced Performance Features:**   - **Sync Header Bypass:** Streamlines data flow by bypassing synchronous header processing. **Power Efficiency and Reliability:**   - **Comprehensive Power Management:** Supports all low-power states for energy efficiency. - **Advanced RAS Features:** Includes Viral and Data Poisoning for enhanced system resilience. **Seamless Integration and Serviceability:**   - **Hot-Plug Capabilities:** Allows devices to be inserted or removed without interrupting operations. **Advanced Endpoint Capabilities:**   - **RCiEP (CXL 1.1 Support):** Integrates RC Integrated Endpoint functionality for versatile endpoint configurations. **Efficient Memory Coherence:**   - **Back Invalidation Request/Response:** Ensures efficient data coherence in CXL.mem operations. **Driving Innovation Forward:** Elevate your infrastructure with our CXL 3.0 Controller IP Core, ideal for high-performance computing, AI, and data-intensive applications.

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Great OFC coverage by LightCounting. TeraSignal’s Intelligent Re-Driver in CMOS is changing the power, reliability and performance calculus between DSP and LPO modules.

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High Bandwidth Memory (HBM) and Double Data Rate (DDR) memory are two types of memory technologies used in modern computing systems, but they differ in several key aspects: Memory Architecture: - DDR Memory: DDR memory is a type of synchronous dynamic random-access memory (SDRAM) that stores data in separate memory cells. It is typically used in conventional system memory modules that are connected to the CPU via a memory controller and a memory bus. - HBM: HBM is a newer type of memory architecture that uses a stacked design, where multiple layers of DRAM chips are vertically stacked on top of each other and interconnected using through-silicon vias (TSVs). This stacked design allows for a significant increase in memory bandwidth compared to traditional memory technologies. Bandwidth: - DDR Memory: DDR memory typically has lower bandwidth compared to HBM. DDR memory achieves data transfer rates by transferring data on both the rising and falling edges of the clock signal. - HBM: HBM offers significantly higher bandwidth compared to DDR memory due to its stacked design and wider data bus. This high bandwidth makes HBM well-suited for applications that require high-speed data processing, such as high-performance computing, artificial intelligence, and graphics processing. Power Efficiency: - DDR Memory: DDR memory tends to consume more power compared to HBM due to its architecture and data transfer mechanisms. - HBM: HBM is designed to be more power-efficient than DDR memory, making it suitable for applications where power consumption is a critical factor, such as in mobile devices or data centers. Physical Size: - DDR Memory: DDR memory modules are larger in physical size compared to HBM due to their traditional form factor and packaging. - HBM: HBM's stacked design allows for a more compact form factor, which can be beneficial for applications where space is limited, such as in graphics cards and other small form factor devices. In summary, HBM and DDR memory differ in their memory architecture, bandwidth, power efficiency, and physical size. HBM offers higher bandwidth and better power efficiency compared to DDR memory, making it well-suited for high-performance computing applications.

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