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Overview

Highlights

  • Maximum throughput and density for performance-intensive storage applications
  • Enhanced support for EDSFF E3.S form factor drives
  • Ultra-high density - up to 960TB in 1U or 1.92PB in 2U

Innovations

  • About Servers Optimized and Highest Throughput Performance
    Symmetrical dual processor architecture shortens data paths to reduce latency
  • About Storage Enclosures for Easy Capacity Expansion
    Supports up 8 CXL 2.0 devices for increased shared memory pool
  • About All-Flash Solutions for Dual-Port NVMe SSDs
    New support for the OCP Data Center Modular Hardware System (DC-MHS)

Optimized for:

  • Enterprise Applications
  • Data Center
  • Hyperscale / Hyperconverged
  • Software-defined Storage
  • Data Warehousing

Product Lines

E3.S

1U and 2U rackmount
16 E3.S drives in 1U or 32 E3.S drives in 2U
Up to 4 optional CXL bays
Single or dual processor architectures
Up to 32 DIMMs DDR5

E1.S

1U rackmount
24 E1.S drives in 1U
Dual processor architecture
Up to 32 DIMMs DDR5

U.2

1U and 2U rackmount
12 drives in 1U or 24 drives in 2U
Single processor architecture
Up to 32 DIMMs DDR5

Models

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Generation
Features

Certain products may not be available in your region