A shoutout to our incredible partners, TSMC, GUC, Siemens, Intel Corporation, Universal Chiplet Interconnect Express (UCIe), Teradyne, and Andes Technology Corporation! Your presentations at our #DAC booth sparked engaging conversations and great insights. Thank you to everyone who attended these sessions and learned more about the latest advancements in chip technology. #DAC2024 #DAC61st #Innovation #InChipMonitoring #DeepData #Healthandperformance #DataAnalytics #Chiplets #AI #Automotive #Safety
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